Sponsors of HiPC 2022

29th IEEE INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE COMPUTING, DATA, & ANALYTICS

HiPC 2022 will be the 29th edition of the IEEE International Conference on High Performance Computing, Data, Analytics, and Data Science. HiPC serves as a forum to present current work by researchers from around the world as well as highlight activities in Asia in the areas of high performance computing and data science. The meeting focuses on all aspects of high performance computing systems, data science and analytics, and their scientific, engineering, and commercial applications.

 

The HiPC conference series has a strong relationship with industry, both within India and internationally, including industry involvement in its steering and organizing committees. The conference welcomes (and strongly encourages) industry participation at all levels including in the technical program, the student symposium, and especially in the industry, research and user symposium, and vendor exhibition. Details about these and other events in the past years of the conference are available at the conference website. Various sponsorship opportunities are available, as listed below. Sponsors are encouraged to participate in defining the industry, research, and user symposium events. Companies and R&D laboratories are encouraged to present their exhibits at the conference. The following sponsorship levels are available. Each level comes with complimentary registrations, as listed below.

 

Sponsorship Level

Sponsorship Cost

Complimentary Registrations

USD (in thousands)

INR (in lakhs)*

Titanium

20

16

50

Platinum

15

12

30

Gold

7

5.5

20

Exhibitor

3

2.5

5

*Updated to reflect the new exchange rates

 

Each sponsor receives the following complimentary benefits:

  • Booth at the conference exhibition
  • Logo on the website, publicity materials, program booklet, highlights flyer, and conference banner
  • Link from the HiPC page to a microsite of your choice
  • Option to conduct one two-hour birds of a feather (BOF) session with room for 70+ attendees (for titanium and platinum levels only)
  • Industry Opening Gala

Additional full conference passes may be purchased by sponsors at all levels. Please contact the HiPC industry liaison co-chairs for full details.

Note: Complimentary registrations can not be distributed to other industrial organizations who have been our sponsors in the past five editions.

All sponsorship invoicing and payments must be completed by November 30th, 2022.

 

Industry Liaisons Co-Chairs ([email protected])

Rama Govindaraju, Google, USA

Vivek Yadav, FullStackNet, Indi2